Wafer Works groundbreaking ceremony heralds creation of a new 200 mm fab in Zhengzhou, Henan, China, planning to mass production in 2018

Taoyuan, Taiwan, July 27^th, 2017

Wafer Works today announced construction of a new fab by a groundbreaking ceremony held in Zhengzhou Airport Economy Zone, Henan, China. Mr. Pat Chiao, the chairman of Wafer Works, and his management team hosted the ceremony with appreciation on enthusiastic participation of the top officials of the Henan Province Government and the Zhengzhou City Government. The ceremony caught attention greatly in public since the new fab is the first investment project in fields of semiconductor locally in Zhengzhou.

In response to the booming semiconductor market, especially in China, Wafer Works dedicates to root in the supplying chain localized in China by expanding its capacity of high-end silicon wafers. Expansion of the new fab in Zhengzhou will bring the 200 mm market a capacity of 200,000 polished wafers per month based on the investment in amount of $1.2B RMB. The new fab in Zhengzhou can make weakness of semiconductor materials in China strengthened and, furthermore, ignite upgrading of industrial development in Henan when the mass production get ready in Q2, 2018.

Demand of silicon wafers consumed in China’s semiconductor market relies on import by >85% for 200 mm wafers and >99% for 300 mm wafers. In the coming two years till 2020, there will be extra 26 IC-fabs newly created in China, leading to the wafer demand in the China market booming even more extremely. To fit in the market opportunity, Wafer Works has been ready to show its dominance covering from crystals to epitaxy based on the development strategy of “Stand on success in 200 mm to reach 300 mm more successful!