Product Layout

As a globally renowned supplier of semiconductor silicon wafers, Wafer Works has been dedicated to providing top-notch products and services to customers. Our products include 12-inch (and below) polished wafers, epitaxial wafers, double-side wafers, lapped wafers, etched wafers, ultra-thick and ultra-thin wafers, and SOI wafers, with various doping choices. Moreover, we offer customers the most suitable products and services tailored to the unique requirements of different applications. Drawing on our expertise in materials and our integrated technology spanning crystal growth to epitaxial deposition, we ensure that we meet and exceed our customers' present and future needs. Take 8-inch products as an example, the below graph illustrates the product layout we offer, which is categorized based on a wide range of components and end applications. Each category is thoughtfully matched with the most suitable materials and production technology, enabling us to deliver highly customized products and services. We provide a similar product layout for wafers in other sizes as well. For more information and details, please feel free to contact us.

 

 

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Specific

Polished wafer type

From ultra-low to ultra-high resistivity

  • N/P type Epitaxy and SOI are available

Example of device

MEMS, power MOSFET, PMIC(power management IC) and more

 

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Power

Polished wafer type

low resistivity or ultra-low resistivity

  • N/P type Epitaxy is available

Example of device

power MOSFET, BJT, diode, thyristor, IGBT, CoolMOS, superjunction and more

 

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Imaging

Polished wafer type

low resistivity

  • N/P type Epitaxy is available

Example of device

Image sensor, CIS(COMS image sensor) and more

 

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Analog

Polished wafer type

Lightly doped wafer

  • N/P type Epitaxy is available

Example of device

LED driver, PMIC(power management IC) and more

 

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Logic

Polished wafer type

Lightly doped wafer

  • N/P type Epitaxy is available

Example of device

Standard logic IC and ASIC(application specific IC)

 

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RF

Polished wafer type

Ultra-high resistivity

  • N/P type Epitaxy and SOI are available
  • Polished wafer is ready for GaN epitaxy

Example of device

RF devices

 

 

 

Technology Platform

With a comprehensive product layout, Wafer Works has amassed self-developed skills and expertise, encompassing various stages from crystal growth to epitaxial deposition. The table below outlines the essential technologies we possess.

advantage01Crystal Growth Technology

  • Design ability of crystal growth thermal fields
  • Design ability of control systems
  • Crystal growth simulation technology
  • Ultra-low resistivity crystal growth technology (high doping)
  • Ultra-low defect crystal growth technology (light doping)
  • High resistivity low oxygen content crystal growth technology
  • Multi-element doping crystal growth technology

 

advantage02

Wafer Technology

  • Wafer stress control technology
  • Double-sided polished technology
  • Wafer backside coating technology
  • Heat treatment technology
  • Wafer bonding technology

advantage03

Epitaxial Technology

  • Multi-layer epitaxial technology
  • Ultra-thick epitaxial technology
  • Buried layer epitaxial technology
  • Heterogeneous epitaxial technology

 

 

Technology Development

Wafer Works sets its sights on becoming a leading supplier of semiconductor silicon wafers, being determined to achieve self-development in cutting-edge technologies. Apart from establishing a comprehensive product layout, we are committed to driving the efficient progression of wafer dimension development, which shortens the timelines for technological research, innovation, and development, enabling us to swiftly enter target markets and cultivate a strong customer base.

 

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